ASM International N.V. to Host Interconnect Technology Seminar
ALMERE, The Netherlands - May 29, 2009 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM) will host an interconnect technology seminar on Tuesday, June 2, 2009 at the Royton Sapporo Regent Hall in Sapporo, Japan. The seminar is being held in conjunction with the 12th IEEE International Interconnect Technology Conference (IITC).
At the seminar, Masazumi Matsuura, Senior Engineer of Back-end Thin Film Technology at Renesas Technology Corporation will discuss "Technology Boosters using UV Curing for Advanced SoC Devices".
To conclude the program, ASMI will host a Poster Session addressing Low Temperature PEALD for Spacer Defined double Patterning, ALD for Phase Change Memory, Metal Deposition in Batch Furnace, the Integration of Low-k Materials, and UV Cure for Logic and Memory.
About ASM International
ASM International N.V., headquartered in Almere, the Netherlands, and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's website at www.asm.com
Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: All matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to, economic conditions and trends in the semiconductor industry generally and the timing of the industry cycles specifically, currency fluctuations, financing and liquidity matters, the success of restructurings, the timing of significant orders, market acceptance of new products, competitive factors, litigation involving intellectual property, shareholder and other issues, commercial and economic disruption due to natural disasters, terrorist activity, armed conflict or political instability, epidemics and other risks indicated in the Company's filings from time to time with the U.S. Securities and Exchange Commission, including, but not limited to, the Company's reports on Form 20-F and Form 6-K. The Company assumes no obligation nor intends to update or revise any forward-looking statements to reflect future developments or circumstances.
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Press release 29 May 2009