ASM focuses on three parts of the semiconductor industry manufacturing process: wafer processing, assembly & packaging and surface mount technology.
Within wafer processing, we focus on three distinct processes: wafer manufacturing, transistor formation and interconnect.
Our core strengths are in Atomic Layer Deposition (ALD), Plasma Enhanced ALD (PEALD), Epitaxy, Plasma Enhanced Chemical Vapor Deposition (PECVD), Low Pressure Chemical Vapor Deposition (LPCVD) and Oxidation/Diffusion. With this portfolio of established and newer technologies, we're addressing the key areas on the semiconductor industry roadmap:
- High-k metal gate;
- Dielectrics for double patterning;
- Low-k dielectrics for interconnect and;
- Strained silicon.
Enabling the industry to move to smaller line-widths and better transistors that use new materials. Our discoveries are resulting in greater efficiencies for businesses and greater opportunities for everyone.
ASSEMBLY & PACKAGING
ASMI owns 40.08% of ASM Pacific Technology Ltd (ASMPT). ASMPT is the world's largest assembly & packaging equipment supplier for the semiconductor and LED industries and is a leading supplier of stamped and etched lead frames.
With headquarters in Hong Kong, and operations in the People's Republic of China, Singapore and Malaysia, ASMPT offers the most comprehensive leading edge portfolio for all of the major process steps in assembly & packaging, from die attach through to encapsulation.
SURFACE MOUNT TECHNOLOGY
In early 2011, ASMPT entered the Surface Mount Technology (SMT) market through the acquisition of the Siemens Electronics Assembly Systems business from Siemens AG. With its headquarters in Munich, Germany, ASM Assembly Systems (ASMAS) offers SMT placement tools for the global electronics manufacturing industries.