Both ASM International’s Front-end and Back-end product lines are positioned to serve the immediate and future needs of the semiconductor industry. ASM’s tools are engineered for leading-edge processes. Our engineering focuses on deposition quality and particle control with high throughput that results in low cost of ownership. With most of the newly installed semiconductor device fabrication capacity employing 300mm wafers, our system and process development as well as our sales efforts are concentrated on 300mm equipment. Today, we support high volume production systems at 90, 65 & 45 nanometers, and in close cooperation with our customers we are qualifying and testing new critical process equipment for line widths at or below 32nm. Simultaneously, we are developing new 22nm technologies in our laboratories.