The key elements of our strategy include:
ASMI has always been recognized for its technology leadership. Today, we provide leading technologies that support our customers in staying on the curve of Moore’s Law. Our innovative strength is what differentiates us in the marketplace and continues to be the cornerstone of our strategy. Apart from our internal R&D efforts we are continuously expanding and deepening our strategic cooperation with key customers, suppliers, chemicals manufacturers and research institutes such as imec. We also expand our patent portfolio where it is necessary and beneficial.
Leadership in ALD
ALD and PEALD technologies have been established as mainstream technologies in high volume manufacturing, supporting virtually all of the leading customers in the semiconductor industry. As a leader in this space, ALD and PEALD have turned into a key growth driver for our business. We expect that the trends of continued scaling and evolution towards 3D device structures will further expand the number of applications for ALD. We aim to maintain our leading position in ALD by leveraging on our strong expertise and established customer relationships, and by developing new applications to support our customers with increasingly complex device node transitions.
While technology leadership remains crucial, we continue to focus on further improving the effectiveness of our organization and the efficiency of processes. We aim to provide our customers with dependable leading-edge products and services at a consistent quality and the best cost of ownership. To this end, we continue to optimize our manufacturing and global sourcing processes, including the migration to common product platforms.
Within wafer processing, we focus primarily on equipment and process solutions for the deposition of thin films.
Our core strengths are in atomic layer deposition ('ALD'), plasma enhanced ALD ('PEALD'), epitaxy, plasma enhanced chemical vapor deposition ('PECVD'), low pressure chemical vapor deposition ('LPCVD') and oxidation/diffusion. With this portfolio of technologies, we are addressing many of the key areas on the semiconductor industry roadmap, including:
- high-k metal gate;
- new applications for advanced FinFET transistors;
- dielectrics for spacer-defined double patterning;
- low-k dielectrics for interconnect; and
- strained silicon.
Our breakthrough technologies enable the industry to move to smaller line widths and better transistors that use new materials. In addition to addressing the technology needs of our customers, and in order to meet the requirements of the industry to reduce cost, we focus on further increasing equipment throughput and equipment reliability, further lowering the cost per wafer of our wafer processing systems. In addition, in order to enable further efficiencies in our manufacturing process, we spend significant effort on improving the level of standardization in our equipment portfolio by migrating to common platforms, sub-assemblies and components.