The future is made up of many layers
Global demand for semiconductors is exploding as chips enable technological advances for an expanding number of applications. The cloud, smart vehicles, the desire to be fully connected at all times for email, phone and the internet. All these factors and more are driving the demand for smaller, faster, cheaper chips.
ASM’s technology enables the deposition of the semiconductor material layers that create the advanced chips of the future. More applications, more transistors, more complexity all adds up to more layers. And all these different layers are combining to create a world of new possibilities. ASM is helping to solve the key issues on the semiconductor technology roadmap today and in the future.
MOORE TO COME
The semiconductor industry is committed to reducing the size of transistors so that more of them fit in the same physical space. Our customers are now manufacturing transistors 22 nanometers wide. That’s roughly four thousand times smaller than the width of a single human hair. Today’s most advanced microprocessor chips include over 2 billion transistors. To deliver these ever-shrinking dimensions while improving transistor performance, the top chip manufacturers rely on ASM deposition technology.
In 1999, ASM was one of the first companies to recognize the potential of Atomic Layer Deposition (ALD), making it possible to manufacture today’s 22nm wide transistors with great precision. ALD is now one of our most important platforms for a whole new set of materials that will keep giving the world Moore.