At SEMICON Taiwan 2025, we lit up the show floor by showcasing how the art of atomic layering is powering the next wave of semiconductor innovation. With over 100,000 visitors at the show, this year’s event is a key moment to spotlight our leadership in advanced manufacturing for the AI era.

IC Forum: Every monolayer matters

At the IC Forum, our VP of Technology, Glen Wilk, took the stage with a powerful keynote: “Every monolayer matters.” Glen unpacked how atomic layer deposition (ALD), epitaxy (Epi), and area-selective deposition (ASD) are driving the next wave of semiconductor scaling. ALD deposits one atomic layer at a time with digital precision, while Epi builds crystalline structures with exact control – both essential for stacking transistors vertically in GAA and CFET. This level of atomic-scale mastery is what makes AI-ready chips faster, smaller, and more reliable.

AI Technology Zone: Master of atomic layering

“Have you mastered atomic layering?” quickly became the catchphrase of the show. At the AI Technology Zone, our booth turned into a magnet for curious minds. Visitors jumped into our interactive game – layering atoms to hit the perfect thickness – and walked away with their own AI-generated “Master of atomic layering” badge. From dielectric to conductive layers, they got hands-on with the science behind the chips powering AI, robotics, and the smart tech shaping tomorrow.