Dragon ® XP8

Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The Dragon XP8 PECVD system can be configured with up to four Dual Chamber Modules (DCM) enabling eight chambers in high-volume production within a very compact footprint.

High volume, compact footprint.

Major features

Dragon XP8 is a high productivity PECVD tool that addresses a broad range of dielectric films for various low-temperature deposition applications, such as interconnect layers, passivation layers, and etch stop layers. 


Dragon XP8 benefits

  • Independent chambers for optimum true single wafer performance; 
  • Low volume chamber for efficient gas use and fast processing;
  • Excellent chamber-to-chamber matching for wafer-to-wafer repeatability;
  • Low cost of ownership;
  • Easy opening chamber design for fast maintenance;
  • Efficient energy consumption. 


Major applications

  • Inter Layer Dielectric Films: TEOS-SiO, SiH4-SiO; 
  • Passivation: SiN; 
  • Anti-Reflective Layer: SiN, SiON; 
  • Etch stop: SiN; 
  • Through Silicon Via Films SiO, SIN;
  • Dielectrics for 3D memory stack.​​