XP8® Vertos™
The XP8® Vertos™ consolidates critical patterning steps into an integrated process by combining gap-fill and planarization in a single system.
Major features
Vertos™ is a novel PECVD process that seamlessly fills even the most complex high-aspect-ratio features without voids or seams and self-planarizes across the wafer. This process occurs in an all-in-one PECVD system.
XP8® Vertos™ benefits
- Proven gap-fill, topography control, and pattern fidelity
- Simplified integration through a single platform solution
- Unlocks next-generation logic and memory scaling
Major applications
- Supports applications across logic and memory
- Enables innovative approaches for dipole and work-function material patterning
- Applicable to structures ranging from trenches to micron-scale cavities