Our company

ASM is a materials discovery company, focused on enabling the next era of semiconductor innovation through materials purpose, engineering, and scale.

4800+ people worldwide

15 key locations

70+ nationalities working at ASM

58 years of research, innovation and breakthrough technologies

Staying ahead of what's next

At ASM, we’re shaping the future at the atomic level. We enable the next generation of microchips by empowering leading semiconductor manufacturers with advanced wafer processing equipment. Through our mastery of thin-film deposition, we create the innovative tools and solutions that shape the materials at the heart of tomorrow’s technology – powering everything from AI and next-generation healthcare to cloud computing and smarter, more energy-efficient devices.

Materials purpose

We anticipate the material requirements of future devices across logic, memory, packaging, and interconnects.

Materials engineering

We engineer composition, behavior, and control at the atomic level to deliver specific electrical, physical, and thermal outcomes.

Materials scale

We translate materials breakthroughs into manufacturable processes using ALD, epitaxy, PECVD, and surface modification.

Scaling is now a materials problem

1 / 5

S/DTCO + materials

Design and architecture advances increasingly depend on materials performance. Co-optimizing systems, design, technology, and materials is now the dominant driver of scaling.

2 / 5

Logic 3D scaling

Logic scaling has moved from planar shrink to 3D architectures such as GAA and CFET. These structures demand new materials, tighter thickness control, and perfect conformality at the atomic scale.

3 / 5

Memory 3D scaling

DRAM density now increases by building upward, not just shrinking laterally. Uniform, defect free films and atomic scale deposition are key to managing leakage, power, and reliability in tall 3D structures

4 / 5

Package scaling

Advanced packaging enables performance gains through tighter integration and chiplet architectures. This increases demand for new materials supporting bonding, gap-fill, stress management, and thermal performance.

5 / 5

Interconnects

As devices scale in 3D, interconnects must carry more current in less space and at lower temperatures. Materials innovation enables lower resistance, better reliability, and improved thermal behavior

Growth through innovation strategy

1. Maintain leading share in ALD for logic/foundry and grow share in DRAM/HBM memory

AI/ML enabled common platform coupled with novel chemistries to accelerate innovation and ensure manufacturing excellence

2. Continue to grow in Epi

Capture new epitaxy inflections in logic/foundry and DRAM

3. Grow applications in advanced packaging market

Grow in PECVD, ALD, surface prep, CMP and others, leveraging our strength in chemistry innovation and surface engineering

4. Grow high value service products

Innovate in intelligent and environmentally friendly solutions while delivering greater performance and value
to our customers

5. Accelerate progress in sustainability

Focusing on chemical effectiveness and reduced precursor and energy consumption

6. Drive operational excellence, flexible footprint and strong topline profitable growth

Targeting revenue >€5.7B and operating margin >30% by 2030

Find out more

Meet our leadership

We have a two-tier board structure, with two Management Board members and five Supervisory Board members. In 2022, we established an Executive Committee to help the Management Board drive and execute ASM's strategy.