Gary Ding joins ASM as Chief Product Officer, bringing more than 30 years of semiconductor industry experience from Intel, where he held a series of senior leadership roles.  

At Intel, he specialized in advanced process technology development, leading large teams responsible for innovations in logic device manufacturing, including the introduction of new materials for metals, Epi and dielectrics, as well as planarization across multiple technology nodes.    

He played a pivotal role in driving innovations that enabled critical components for Intel’s copper interconnect, FinFET and gate-all-around technology nodes, and was instrumental in driving technology collaborations with leading equipment suppliers worldwide.  

Throughout his career at Intel, Gary earned a reputation for excellence. Known for his strong focus on developing talent and nurturing future leaders, Gary has built and guided highly competent executives who have driven progress toward strategic goals.    

Gary holds a Ph.D. in Materials Science and Engineering (with a minor in Applied Physics) from Cornell University and a B.S. in Physics from Peking University.