HVM Field Process Engineer – Plasma Etch ALD (PEALD)

As a Field Process Engineer specializing in Plasma Etch Atomic Layer Deposition (PEALD), you will serve as the on-site process expert supporting ASM’s XP8 DCM & QCM process tool platforms at customer high-volume manufacturing (HVM) sites. You will be responsible for process optimization, troubleshooting, and sustaining activities, acting as a critical technical interface between ASM and its customers.

This role is ideal for engineers who thrive in dynamic environments, enjoy hands-on problem-solving, and are passionate about enabling next-generation semiconductor technologies.

Key Responsibilities

On-site process support:

• Lead process qualification and optimization during tool installation and ramp-up phases.
• Ensure customer process specifications, timelines, and ASM budget targets are met.
• Design and execute experiments (e.g., DOEs) to improve film quality, uniformity, and throughput.
• Provide structured troubleshooting and root cause analysis for process-related issues.
• Collaborate with customer process and hardware teams to drive continuous improvement and tool-to-tool matching.
• Document and share lessons learned across internal teams and global accounts.

Customer Engagement:

• Build and maintain strong technical relationships with customer stakeholders.
• Anticipate customer needs and propose sustainable, long-term solutions.
• Support escalations with clear communication, action plans, and follow-through.
• Represent ASM’s technical capabilities with professionalism and integrity.

Competencies to be Successful.

• Capable of working in a multi-cultural organization.
• Remain poise in high-stress situations.
• Accountability for one’s work.
• High empathy for our customers.
• Strong troubleshooting methodology and solution selection experience.
• Driven to eliminate failure modes and drive solutions by collaborating with multiple stakeholders.
• Well organized individual capable of illustrating those thoughts and translating plans into action within a matrixed environment.
• Excellence in communication (verbal and written)
• Tenacity to get the job done thoroughly and accurately.
• Proactive attitude to resolve issues.
• Being able to adapt to change in priorities based on customer requirements.

Education/Experience/Skills Requirements

• Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field.
• Broad technical experience and business perspective preferably in the Semiconductor / Capital Equipment industry.
• Knowledge of and experience with semiconductor device applications, vacuum techniques, film characterization and metrology techniques, and deposition processes and equipment. Preference will be given to candidates who have a demonstrated history of working in HVM environments preferably with ASM equipment.
• Experience on ASM XP8-DCM/QCM process tool and/or Plasma etch process.
• Experience with advanced troubleshooting/structured problem analysis methodologies.
• Experience designing and conducting experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using DOEs and statistical methods.
• Proactively support escalations, develop and manage action plans, and ensure clear communication between customer, service team, business unit, or other sub-suppliers.
• Ability to travel up to 25%, as necessary and possibly for extended periods of time for training and technical engagement, as well as to other Customer sites, as needed.
• In case of escalations, additional hours and working weekends may be required.

Must understand the Intellectual Property boundaries between ASM and the Customer and be able to maintain IP, as appropriate, during all external and internal interactions.