NPI Engineering Intern - Advanced Package Technology
Job details
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
About the Internship
Our Summer internship provides an experience in the fast-paced and exciting semiconductor industry. Our interns will work alongside industry projects and gain valuable insights into our core engineering roles. This program is designed to grow and shape the industry leaders of tomorrow, offering a chance to learn, develop and build the skills needed for a successful career in the semiconductor field.
What to expect
This position is a paid internship. The duration will be in Hsin-Chu (Hybrid Model). Our internship program is for students who are actively enrolled in a full-time academic program. Recent graduates seeking employment after graduation and not returning to school should apply for our Early Career opportunities.
Job's mission
We are seeking a highly motivated Engineering Intern to support early‑stage research and evaluation of advanced package technology.
This internship focuses on technology surveying, literature analysis, and knowledge synthesis. The intern will conduct a structured review of academic and publicly available industry research to develop a clear, well‑organized overview of the current Package development landscape. The results will support technical discussions and future exploratory R&D work.
This role is ideal for PhD students with a strong background in semiconductor package process, like 3DIC or 2.5D integration, or related research fields who are interested in advanced package beyond the state of the art.
What you will be working on
- Conduct a systematic review of package‑related information from:
- Academic journals and conference proceedings
- Patents and publicly available industry sources
- Organize and synthesize fragmented information into a structured technical knowledge base
- Identify key technological trends, including:
- Process concepts and material approaches
- Integration strategies and reported demonstrations
- Performance targets and extendibility considerations
- Analyze and summarize major technical challenges and development bottlenecks identified in literature
- Perform a high‑level scan of early industry and ecosystem signals, such as patents or collaborations
- Prepare clear documentation and presentations that distinguish evidence‑based insights from areas of uncertainty
Deliverables
- A consolidated and well‑structured technology review report on 3DIC
- Structured summaries of technical trends and key challenges
- Presentation materials suitable for technical discussions and evaluations
What You Will Gain
- Hands‑on experience evaluating an early‑stage, next‑generation semiconductor package technology
- Exposure to how advanced technology concepts are assessed prior to major R&D investment
- Opportunity to develop strong skills in technical analysis, literature review, and technology scouting
- Experience working closely with senior engineers and researchers in advanced technology development
What we are looking for
- Currently pursuing a PhD degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field
- Fundamental understanding of semiconductor package and/or process integration
- Strong ability to read, analyze, and synthesize technical literature
- Solid written communication skills in English
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.