Process Section Manager – Plasma ALD (PEALD), High-Volume Manufacturing (HVM)

As a Process Section Manager specializing in Plasma Etch Atomic Layer Deposition (PEALD), you will lead a team of field process engineers and serve as the on-site process expert supporting ASM’s XP8 DCM & QCM platforms at customer high-volume manufacturing (HVM) sites.

This role is ideal for leaders who thrive in dynamic environments, enjoy hands-on problem-solving, and are passionate about enabling next-generation semiconductor technologies.

Key Responsibilities

Team Leadership:

• Lead, mentor, and develop a high-performing team of field process engineers and technicians.
• Oversee scheduling, performance management, and training to ensure team adaptability and excellence.
• Foster a culture of accountability, collaboration, and continuous improvement.

Technical Process Support:

• Act as the primary escalation point for complex technical issues and process failures.
• Guide structured troubleshooting and root cause analysis (RCA) to minimize tool or line downtime.
• Lead process qualification and optimization during tool installation and ramp-up phases.
• Design and execute experiments (e.g., DOEs) to improve film quality, uniformity, and throughput.
• Ensure alignment with customer specifications, timelines, and ASM budget targets.

Cross-Functional Collaboration:

• Partner with customer process and hardware teams to drive continuous improvement and tool-to-tool matching.
• Document and share lessons learned across internal teams and global accounts.

Customer Engagement:

• Build and maintain strong technical relationships with customer stakeholders.
• Anticipate customer needs and propose sustainable, long-term solutions.
• Support escalations with clear communication, action plans, and follow-through.
• Represent ASM’s technical capabilities with professionalism and integrity.

Key Competencies

• Strong leadership and team-building skills in a multicultural environment.
• High empathy and customer-centric mindset.
• Structured troubleshooting and solution development experience.
• Excellent verbal and written communication skills.
• Ability to remain poised under pressure and adapt to changing priorities.
• Organized and capable of translating plans into action within a matrixed organization.
• Tenacity and proactive attitude to resolve issues thoroughly and accurately.

Qualifications

• Master’s or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field.
• 5+ years of supervisory or management experience in high-volume manufacturing, preferably in field service or production.
• Proven ability to lead and motivate diverse teams to achieve ambitious goals.
• Broad technical experience in the Semiconductor / Capital Equipment industry.
• Hands-on experience with ASM XP8-DCM/QCM process tools and/or Plasma Etch processes.
• Deep understanding of semiconductor device applications, vacuum techniques, film characterization, and deposition processes.
• Experience designing and conducting experiments using DOEs and statistical methods.
• Skilled in advanced troubleshooting and structured problem analysis methodologies.
• Ability to travel up to 25%, including extended periods for training or customer site support.
• Willingness to work additional hours or weekends during escalations.
• Strong understanding of Intellectual Property boundaries between ASM and customers.