Senior Director, Global Product Management (Advanced Packaging)
Job details
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job's mission
As Senior Director of Global Product Management, you will define and drive the strategic roadmap for ASM’s advanced packaging equipment portfolio, shaping the future of semiconductor innovation. This role leads global product strategies across Hybrid Bonding, Thermocompression Bonding, CoWoS, TSV, and wafer-level processes, aligning technology capabilities with market inflection points. You will partner with executive leadership and tier-1 customers to deliver breakthrough solutions and achieve aggressive growth targets.
What you will be working on
- Deliver revenue growth, gross margin, and market share objectives for advanced packaging equipment.
- Develop and present multi-year product roadmaps to executive leadership, aligning technology with market trends.
- Define and execute customer penetration strategies at strategic accounts.
- Lead cross-functional teams (R&D, engineering, marketing, sales, operations) to ensure on-time, on-spec product releases following the semiconductor equipment PLC process.
- Negotiate and structure strategic agreements with key customers and ecosystem partners.
- Serve as the voice of the customer internally; translate technical requirements into actionable product specifications.
- Drive competitive positioning, win/loss analysis, and pricing strategy.
What we are looking for
- Minimum 20 years of experience in the semiconductor capital equipment industry.
- Prior role as Key Product Unit (KPU) or Deputy KPU Head with full P&L responsibility.
- Proven track record of presenting product roadmaps and strategies to C-level executives.
- Deep technical expertise in advanced packaging processes, including Hybrid Bonding, Thermocompression Bonding, CoWoS/InFO/TSV, wafer-level deposition (PVD, PECVD, ALD, ECP), and surface preparation.
- Experience managing semiconductor equipment product release cycles (PLC) from concept to high-volume manufacturing.
- Demonstrated success in customer engagement at tier-1 accounts.
- Bachelor’s degree in engineering or related field.
What sets you apart
- Global mindset with experience managing cross-functional teams.
- Excellent communication skills and executive presence.
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.