XP8® DCM™ PEALD
XP8® DCM™ is a high-productivity 300 mm plasma-enhanced atomic layer deposition (PEALD) system designed for advanced semiconductor applications. Configurable with up to four Dual Chamber Modules (DCM), it supports eight reaction chambers for high-volume production within a compact footprint for SiO, SiN and TiO, delivering outstanding throughput and process flexibility.
Major features
XP8® DCM™ is a high-productivity 300 mm plasma-enhanced atomic layer deposition (PEALD) system engineered for advanced semiconductor manufacturing. Configurable with up to four Dual Chamber Modules (DCM), it supports eight reaction chambers for high-volume production in a compact footprint. XP8® DCM™ enables a broad range of dielectric PEALD films and processes, including low-temperature spacers for multiple patterning applications.
XP8® DCM™ PEALD benefits
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Independent reaction chambers (RCs) for optimal performance
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Small-volume RCs for efficient gas use and rapid processing
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Excellent RC-to-RC and chamber-to-chamber matching for superior wafer-to-waferrepeatability
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Low cost of ownership
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Easy-opening chamber design for fast maintenance
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Energy-efficient operation
Major applications
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Liners and spacer layers
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Spacer-based multi-patterning
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High-quality oxide for gate oxide
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Contact liner and gap-fill