XP8® QCM PEALD
XP8 QCM is a PEALD tool focused on advanced node memory and logic applications. It is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.
Major features
XP8 QCM is a 300mm tool for high-productivity plasma enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.
Up to four QCM modules can be configured to each XP8 platform, enabling processing of up to 16 wafers at a time in high-volume production within a compact footprint. The system is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.
XP8 QCM PEALD benefits
-
Independent chambers for optimum performance;
-
Low volume chamber for efficient gas use and fast processing;
-
Excellent chamber-to-chamber matching for wafer-to-wafer repeatability;
-
Low cost of ownership;
-
Easy opening chamber design for fast maintenance;
-
Efficient energy consumption.
Major applications
-
Broad conformal film portfolio for liners, spacers, etch stop layers;
-
Low temperature conformal film portfolio for Spacer Defined Multiple Patterning;
-
High aspect ratio gap-fill