XP8® QCM PEALD

XP8 QCM is a PEALD tool focused on advanced node memory and logic applications. It is capable of a broad range of dielectric PEALD processes, including silicon oxide and silicon nitride.

High productivity, compact footprint.

Major features

XP8® QCM is a high-productivity 300 mm plasma-enhanced atomic layer deposition (PEALD) system designed for advanced semiconductor manufacturing. Configurable with up to four Quad Chamber Modules (QCM), it supports 16 reaction chambers for high-volume production in a compact footprint. XP8® QCM enables a broad range of dielectric PEALD processes, including low-temperature spacers for multiple patterning applications.

 

XP8® QCM PEALD benefits 

  • Independent reaction chambers (RCs) for optimal performance​

  • Small-volume RCs for efficient gas use and rapid processing

  • Excellent RC-to-RC and chamber-to-chamber matching for superior wafer-to-wafer repeatability

  • Low cost of ownership

  • Easy-opening chamber design for fast maintenance​

  • Energy-efficient operation

      

Major applications 

  • SiO liners, hard masks, and spacer layers​

  • Spacer-based multi-patterning layers​

  • Gap-fill for sacrificial and permanent layers​

  • CIS gap-fill using TiO

 

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