The most advanced semiconductor fabrication plants around the world use ASM’s innovative and efficient wafer processing products. Our innovations provide solutions to key issues on the semiconductor industry’s technology roadmap. Enabling the industry to uphold Moore’s law by using new materials and advanced proc​esses for dimensional shrinking and 3D structures. We follow the breakthroughs we make in R&D with reliable and productive equipment suitable for high-volume semiconductor manufacturing. Helping to make integrated circuits or chips smaller, faster and more powerful.



We provide advanced front-end wafer processing equipment engineered for both established and leading edge processes.

Processes such as Atomic Layer Deposition (ALD), Plasma Enhanced ALD (PEALD), Epitaxy, Plasma Enhanced Chemical Vapor Deposition (PECVD), Low Pressure Chemical Vapor Deposition (LPCVD) and Oxidation/Diffusion.​


With a proven track record of more than 50 years of innovation, we’re trusted to make significant breakthroughs in support of the industry’s technology roadmap. Today, we support high-volume production systems capable of creating transistors at 45, 28 and 22 nanometers (nm). Our global teams are now qualifying and testing new critical process equipment for device line widths at and below 14nm in close cooperation with our customers.

At the same time, our R&D department, with established links to leading research institutes around the world, is developing new 10nm technologies in our laboratories. To put that level of nanotechnology in perspective, a single strand of human DNA is 2.5nm wide.


Our engineering and process development activities currently focus on deposition film quality and particle control, combined with high reliability and throughput. This combination results in a low cost of ownership in volume manufacturing.


Our flexibility with both single-wafer and batch processing means we can deliver the optimum solution for our customers. Our single-wafer products include systems with multiple single wafer chambers integrated onto a single wafer handling platform, while our batch processing results in substantially higher throughput and a lower cost per processed wafer.


The XP is ASM’s standard single-wafer product platform, for 300mm wafers. The XP extends performance by integrating up to four process modules, or in the case of the XP8 platform, up to eight chambers in a single system. XP also enables the integration of sequential process steps on one platform. The XP is now available with PECVD, PEALD, Pulsar© and EmerALD ALD modules, and Intrepid epitaxy modules.

The XP common platform benefits our customers through reduced operating costs because multiple ASM products now use many of the same parts and consumables and common control architecture improves their ease of use. The XP common platform also enables us to improve the coherence of our product portfolio.


The XP8 platform follows the basic architectural standards of the XP but provides even higher productivity with up to eight chambers integrated on a single-wafer platform. The XP8 is now available with PECVD, ALD and PEALD modules.



ASM’s Pulsar XP is the industry’s leading Atomic Layer Deposition (ALD) tool for depositing gate dielectrics for advanced transistors. The Intrepid™ XP is our most advanced epitaxy tool for depositing silicon-based strain layers that create next generation transistors.

The XP8 platform can integrate up to eight Atomic Layer Deposition (ALD), Plasma Enhanced Atomic Layer Deposition (PEALD) or Plasma Enhanced Chemical Vapor Deposition (PECVD) reactors in a single system for high productivity.