Plasma Enhanced Chemical Vapor Deposition - products

​​​Plasma Enhanced Chemical Vapor Deposition (PECVD) enables deposition at lower temperatures by using a plasma which is formed from the gaseous chemicals in a reaction chamber.


XP8 is the latest in ASM’s XP family of standard platforms for 300mm wafers, and accommodates up to eight chambers for PEALD or PECVD, which can also be integrated on the same platform.


A central robot designed to move two wafers simultaneously to Dual Chamber Modules (DCM) makes XP8 the highest-productivity single-wafer process tool in the industry. A total of four Dual Chamber Modules can be integrated with the XP8 platform to minimize footprint and maximize productivity for an industry-leading low cost of ownership (CoO) solution.

Our Plasma Enhanced Chemical Vapor Deposition product is the ​Dragon® XP8.​