PECVD
Flexible dielectric deposition enabling low-temperature processing for advanced packaging and integration flows.
About PECVD
What is it?
PECVD, or Plasma-Enhanced Chemical Vapor Deposition, is a specialized technology that utilizes plasma to enable deposition at lower temperatures — perfect for certain applications.
How it works
In PECVD, one or more gaseous reactants are used to form a solid insulating or conducting layer on the surface of a wafer. A plasma is formed from the gaseous chemicals in the reaction chamber.
Plasma CVD
In contrast to traditional CVD, where a higher temperature is used to cause reactions, in PECVD the plasma provides the energy needed to cause the reaction, which means that it can be done at a lower temperature. PECVD gives manufacturers a high throughput capability for the increasing demands of low thermal budget applications.
ASM introduces Flowable Carbon
As chips become more powerful and complex, Flowable Carbon unlocks new possibilities for advanced scaling to power the AI-driven world. It's another example of how ASM turns materials discovery into real-world impact, driving the next wave of semiconductor innovation
Our products
Our tools support a broad set of dielectric applications across interconnect and packaging. Critical for low-temperature integration in complex device stacks, PECVD is increasingly positioned as an enabler of heterogeneous integration and chiplet architectures.
XP8® DCM™ PECVD
The XP8® DCM™ PECVD (Dual Chamber Module, Plasma Enhanced Chemical Vapor Deposition) system is a high-volume manufacturing (HVM) platform engineered for advanced dielectric film deposition, with expanded capabilities for SiO, SiCN for hybrid bonding, and stress-tunable SiN. Built on ASM’s proven XP8® architecture, it integrates four DCMs, totaling eight reaction chambers, to maximize productivity and process control. The system is globally qualified and supports a broad range of applications across both logic and memory nodes.
Technology and products
We have a proven track record of innovation, spanning a wide range of equipment and process technologies now used by the world’s leading semiconductor manufacturers.
-
Atomic Layer Deposition
Industry-leading precision for ultrathin, conformal films critical to advanced logic, memory, and packaging, enabling angstrom-level control at scale.
-
Epitaxy
High-quality crystalline growth engineered for performance, yield, and ramp in advanced 3D architectures.
-
Vertical furnaces
Vertical furnaces offer very high productivity solutions for a wide range of thermal processes including low pressure chemical vapor deposition (LPCVD), diffusion and oxidation.
-
Service products
Outcome-based services that improve uptime, yield, and performance in high-volume manufacturing.